Molybdenum Disc Wafer

Molybdenum disc wafer feem ntau yog siv rau hauv cov khoom siv hluav taws xob ua los ntawm cov khoom siv molybdenum los ntawm cov txheej txheem ntawm cov hmoov hlau metallurgy, uas muaj cov yam ntxwv ntawm cov thermal expansion coefficient zoo ib yam li silicon, kev ua haujlwm zoo, siab melting point, zoo heev hluav taws xob thiab thermal conductivity, kub zoo. dissipation thiab heat absorption muaj nuj nqi, tus nqi qis thiab kev pab lub neej ntev.

Peb Molybdenum disc wafer muaj qhov zoo sib xws qis coefficient ntawm thermal expansion rau silicon thiab kev ua haujlwm siab ua haujlwm. Peb muab ob qho tib si polishing nto thiab lapping nto.

Txuj: ASTM B386

Material: >99.95%

Density: >10.15 g / c

Molybdenum Discs / Squares muaj qhov sib npaug qis ntawm thermal expansion rau silicon thiab zoo dua machining zog. Vim li ntawd, nws feem ntau yog siv rau cov cua sov dissipation raws li cov khoom siv hluav taws xob ntawm lub zog siab thiab kev ntseeg siab semiconductor, cov ntaub ntawv tiv tauj hauv silicon tswj rectifiers diodes, transistors, mounting khoom rau lub hwj chim semiconductor heat sink bases hauv IC'S, LSI'S, thiab hybrid circuits.

Molybdenum disc: Txoj kab uas hla 7 ~ 1 00 hli, thickness 0.15 ~ 4.0 hli

Molybdenum square: 25 ~ 100mm2, thickness 0.15 ~ 1.5 hli

Flatness kam rau ua: ± 0.01 mm

Roughness: Ra< 0.01 um

Molybdenum disc wafer Peb Mo discs thiab Mo squares tau ua tib zoo saib xyuas kom txo qis kev puas tsuaj thaum khaws cia thiab kev thauj mus los thiab khaws cia peb cov khoom zoo hauv qhov qub.

Cim npe nrov: Tuam Tshoj molybdenum disc wafer lwm tus neeg, hoobkas