Nickel-silicon alloys (NiSi) lub hom phiaj muaj kev sib xyaw ntawm npib tsib xee (Ni) thiab silicon (Si) uas feem ntau muaj nyob hauv purity ntawm 99.9% (3N) lossis siab dua. Raws li qhov tshwm sim ntawm kev sib koom ua ke ntawm cov hluav taws xob thiab thermal conductivity ntawm npib tsib xee nrog rau cov khoom siv semiconductor ntawm silicon, cov ntaub ntawv no tau muab faib ua ob qho "siab-kub alloys" thiab yog sputtering qhov chaw rau cov yeeb yaj kiab ua haujlwm. Ni-Silicon (NiSi) alloy sputtering lub hom phiaj ua haujlwm tseem ceeb hauv kev tsim cov khoom qis-resistivity silicide txheej hauv semiconductor sector. Neurotech, raws li NiSi zaj duab xis, qhia tau zoo kawg nkaus conductivity nrog rau zoo thermal stability rau siv nyob rau hauv lub interconnects thiab ohmic contacts nyob rau hauv kev sib cuag circuits. Txhawm rau txhim kho kev ua tau zoo thiab kev ntseeg siab ntawm cov khoom siv nyiaj, cov hlau alloy, nrog rau cov silicon, tsim cov nickel silicide, uas yog ib qho tseem ceeb ntawm cov cuab yeej siv CMOS siab heev rau kev ua tau zoo, ceev ceev, thiab kev sib txuas hluav taws xob zoo.
Yuav ua li cas ib tug Nickel -Silicon Alloy Target Material yog npaj
1. Npaj cov khoom siv raw. Txhawm rau ua tiav qhov txiaj ntsig zoo tshaj plaws, peb tsuas yog siv cov nickel ntshiab thiab ntshiab silicon thiab ntsuas qhov tseeb stoichiometric tus nqi raws li lub hom phiaj alloy theem (xws li Ni / Si 90/10 ntawm%, 80/20 ntawm%).
2. Nqus Melting. Silicon thiab nickel raw cov ntaub ntawv yog poured rau hauv ib tug crucible (feem ntau yog ib tug dej -coj tooj liab crucible). Induction cua sov ua kom tiav nws nrog zirconium thiab tsim nws mus rau hauv ib qho molten alloy. Qhov no tshwm sim nyob rau hauv qhov kub siab - kub, qis- ib puag ncig lub tshuab nqus tsev nrog gaseous impurities xws li H, O, thiab N. Thaum lub sij hawm molten, peb siv electromagnetic stirring los ntxiv refine lub zirconium thiaj li ua tau ib cov kua alloy. Cov molten alloy ua ke yog nchuav rau hauv cov pwm tooj liab, txias, thiab solidifies rau hauv nickel-silicon alloy ingot.
3. Homogenization Thaum tshav kub kub kho. Lub ingot yog muab tso rau hauv homogenous tshav kub kho nyob rau hauv lub tshuab nqus tsev los yog ib qho chaw tiv thaiv (xws li, Ar gas) nyob ib ncig ntawm nws. Nws tau khaws cia ntawm qhov kub ntawm qhov kub ntawm qhov kub thiab txias kom ntev li ntev tau (piv txwv li, 1000402 rau 10 teev).
4. Kub Machining (Kub Forging / Kub Rolling): Lub homogenized ingot yog rhuab mus rau saum lub recrystallization temp (ex., 800-1000 degree) thiab ces kub forged los yog kub dov.
5. Machining: Qhov kub- cov ntawv ua tiav yog machined rau lub hom phiaj qhov ntev thiab cov duab kawg ntawm cov khoom siv nrog siab precision siv lub tshuab rotating thiab milling thiab sib tsoo txoj kev.
Daim ntawv thov ntawm Nickel -Silicon Alloy Sputtering Targets
Semiconductor Interconnects / Contact Layers: NiSi nyias zaj duab xis ua haujlwm ua cov hlau sib cuag, txo kev tiv thaiv kev sib cuag.
Nyias zaj duab xis Resistors thiab Strain Gauges: Tsawg kub coefficient ntawm tsis kam (TCR) cov yam ntxwv ua rau lawv haum rau hybrid ICs thiab MEMS siab sensors.
Nto Electron Emission Layers: Siv los ua cov khoom emitter hauv lub tshuab nqus tsev microelectronics thiab cov khoom siv hluav taws xob hauv teb;
Tsawg-E thiab Zog-Txuag Coatings: Thaum ua ke nrog chromium thiab silicon, lawv tuaj yeem txhim kho oxidation tsis kam thiab corrosion kuj ntawm iav films.
Photovoltaics thiab Cov Lus Qhia: Siv rau kev sib xyaw ua ke ntawm cov yeeb yaj kiab pob tshab, electrodes, lossis cov txheej thaiv thaiv.
